GKG G-STAR Full Automatic Solder paste Printer

Machine Alignment Capability

2Cmk @ ±12.5 microns 6 sigma

Process Alignment Capability

2Cpk @ ±25 microns 6 sigma

Core Cycle Time

< 8.5 secs

(excluding printing & cleaning time)

Product Changeover Time

< 3 mins

New Product Set-up Time

< 10 mins

BOARD HANDLING

Max. Size (L x W)

400 mm x 340 mm

Min. Size (L x W)

50 mm x 50 mm

Thickness

0.4~6 mm

PCB Thickness Adjustment

Manual (Auto is option. PCB max. width reduced to 310 mm)

PCB Max. Weight

3 kg

PCB Edge Clearance

3 mm

PCB Bottom Clearance

15 mm (7 mm with optional auto

PCB thickness adjustment)

PCB Warpage

Max. 1% diagonally

Clamping Method

Top clamp (manual) and motorized side clamp

Support Method

Magnetic support pins, bars, blocks, Vacuum suction

Conveyor Direction

L to R, R to L, R to R, L to L (software control)

Conveyor Height

900 ± 40 mm

Conveyor Speed

Max. 1,500 mm/s

Conveyor Width Adjustment

Automatic

OPERATOR INTERFACE

Hardware

LCD Monitor, Mouse & Keyboard

Operating System (OS)

Windows 7 or Higher

Control Method

Industrial PC controlled

I/O Interface

SMEMA Standard

PRINTING PARAMETERS

Stencil Frame Size (L X W)

Adjustable, 470 mm x 370 mm to 737 mm x 737 mm

Print Gap (snap-off)

0~20 mm

Printing Table Adjustment Range

X: ±3 mm, Y: ±7 mm : ± 2°

Print Speed

6~200 mm/s

Squeegee Pressure

0.5~10kg (program control)

Squeegee Type

Std.: Metal , Option: OPC, rubber

Squeegee Angle

Std. 60°, Option 45°, 50°, 55°

Cleaning System

Auto wet, dry, vacuum (software select)

Operating System

Field-of-View (FOV)

8 mm x 6 mm

Fiducial Types

Circle, triangle, square, diamond, cross

Fiducial size

0.5~3.0 mm

Vision Methodology

CCD camera look up & down

2D inspection

Max.100 windows to inspect missing &

insufficient (std.)

FACILITIES REQUIREMENT

Power Supply

AC220V ± 10% 50/60Hz

Power Consumption

2.5kW

Air Supply

4 ~ 6Kgf/cm²

Dimension (excluding signal tower)

1,158 mm (L) x 1,362 mm (W) x 1,463 mm (H)

Machine Weight

1,000kg